Assembly Support Engineer

What you will do

Assembly Engineering Support

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.

Supplier Coordination

• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.

Issue Resolution & Technical Support

• Investigate and resolve assembly-related issues including yield loss, material defects, and process deviations.
• Support root cause analysis and drive corrective actions in collaboration with quality and process engineering teams.
• Support failure analysis and reliability testing as needed.

Documentation & Reporting

• Maintain detailed documentation of build processes, test results, and lessons learned.
• Gather required documents from Assembly House like POD, substrate drawing, bonding diagram, etc.
• Generate technical reports and present findings to stakeholders and leadership.
• Support DFM & DFA review process.

Continuous Improvement

• Identify opportunities for process optimization and cost reduction in packaging and assembly.
• Contribute to the development of new packaging technologies and methodologies.

Who you are

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or IC assembly engineering.
• Strong understanding of packaging technologies (e.g., wire bonding, flip chip, molding, underfill & SMT).
• Experience working with OSATs and managing external suppliers.
• Knowledgeable in data analysis tools and statistical process control (SPC).
• Excellent problem-solving, communication, and organizational skills.

Preferred Skills

• Familiarity with industry standards (JEDEC, IPC).
• Experience with advanced packaging (e.g., 2.5D/3D IC, fan-out, wafer-level packaging, BGA, etc) assembly processes.
• Knowledge on reliability testing and failure analysis techniques.
• Ability to work in a fast-paced, cross-functional environment.